Teledyne boasts some of the records for the most distant exports, where our image sensors have been central to gaining the first close up images of Pluto, visiting the Kuiper Belt and fly-pasts of Mercury. This experience and proven track record for devices flying for more than 16 years and then performing as planned at that critical moment has informed all our space products and service capabilities allowing us to provide assured products that will perform in the harshest environments which doesn’t get more harsh than deep space.
A vital component to learning more about other worlds is the ability to capture detailed images and spectroscopic data across the visible, UV, NIR and infrared (IR) spectrum. During 30 years involvement with the highest profile missions, the detailed scientific information and images obtained with Teledyne Imaging’s CCD and CMOS sensors and IR FPAs are helping us understand more about our solar system. Key enabling device characteristics that unlock the performance needed for these missions include low noise, very low dark current, deep depleted MCT, large pixel sizes, backside illumination and backthinned detector substrates.
Teledyne Imaging is able to provide the highest performance, optimised and custom package solutions and assemblies for any mission.
With more than 12 flown missions that the Teledyne Imaging group have provided the imaging or detector or system for and several planned missions, Teledyne has a proven and enviable market leading position in space qualified imaging solutions.
Examples:
Resolution: 1024 × 1024 Pixel size: 13 µm Back illumination technology and extremely low noise amplifiers
Resolution: 1024 × 1024 Pixel size: 13 µm Extreme performance in high frame rate ultra-low light applications
Resolution: 1024 × 255 Pixel size: 26 µm Designed for use in the scientific spectroscopy instrument market
Resolution: 1024 × 1024 Pixel size: 10 µm Extreme performance in high frame rate ultra-low light applications
Resolution: 2048 × 515 Pixel size: 13.5 µm Well suited to the most demanding applications, such as spectroscopy.
Resolution: 2048 × 2048 Pixel size: 13.5 µm Well suited to the most demanding applications requiring a high dynamic range.
Resolution: 2048 × 2048 Pixel size: 10 µm Highly flexible CMOS image sensor platform designed for a large range of space applications.
Resolution: 16000 × 4 Pixel size: 5 µm Very high resolution CMOS time delay integration (TDI) image sensors with CCD on CMOS architecture designed for space satellite Earth observation (EO) applications.
Resolution: 244 × 488 Pixel size: 70 µm space qualified CMOS image sensors, with unparalleled performance in terms of sensitivity, radiation tolerance and low power consumption.