Why Teledyne Space Imaging?
Teledyne Space Imaging has a longstanding heritage of developing imaging solutions for the world's foremost space agencies. Since our first launch in 1958 of the U.S. Explorer 1, we have partnered with leaders, including NASA, ESA, JAXA, and KARI to deliver optimized sensors, engineered systems, and technical and consultancy services for over 250 space projects.
We offer a wide range of imaging products, including space qualified imaging sensors, focal plane arrays, sub-systems and cameras for space science, heliophysics, planetary exploration and Earth observation; helping to solve the mysteries of the Universe and understand climate change on Earth.
Teledyne Space Imaging’s technologies and expertise enable scientists to gain an understanding of:
- The Universe and its evolution over time;
- Our solar system including the Sun, planets, and asteroids;
- Our own planet Earth – its atmosphere, land, and oceans and the effects of climate change.
Unmatched Technology & Performance
Teledyne Space Imaging understands the need for high quality and durability. Our state-of-the-art imaging and spectroscopy cameras are designed and manufactured for life. As proof of this commitment, our cooled cameras come with a lifetime vacuum guarantee.
We offer a multitude of detector types, imaging techniques, and package customizations, all available with fully integrated and calibrated electronics. Whatever your imaging challenge, we have the technology, people and facilities to help you succeed.
Key Advantages:
- Wafer scale devices
- CCD, EMCCD, CMOS, and InGaAs options
- Narrow band multi-spectral / hyperspectral solutions
- Anti-reflective coatings, colour and multispectral filters
- Backside thinning for high sensitivity and quantum efficiency
- Ultra-high resolution (100+ megapixels)
- Enhanced full well capacity
- High sensitivity architectures such as TDI
- Ultra-high speed (100 Mpfs)
- Fibre optic attachments
- Ultra-low noise readouts
- Radiation tolerance and radiation hardness
- Custom window attachment and sensor packaging with extended environmental testing for challenging environments